Advanced Semiconductor Assembly Phils.
ManufacturerUnclaimedBack-end assembly and test for power and analog semiconductor devices.
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About
Advanced Semiconductor Assembly Phils. provides wafer dicing, die attach, wire bonding, and encapsulation for ICs used in automotive and industrial applications. Our Calamba cleanroom operates to Class 100 standards for high reliability. We serve global IDMs and fabless companies with high-volume production.
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- 🇺🇸 United States 🇯🇵 Japan 🇰🇷 South Korea 🇹🇼 Taiwan
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